PhD Positions @ UIC

Position Description
Dr. Jida Huang received his Ph.D. degree in Industrial and Systems Engineering from University at Buffalo, the State University of New York. He will join as an Assistant Professor in the Department of Mechanical and Industrial Engineering, the University of Illinois at Chicago from January 1, 2020. Dr. Huang’s research areas focus on computational design for additive manufacturing and data analytics for smart manufacturing. Specifically, his research interests include computational geometry, geometric deep learning, human-robot collaboration, CAD/CAM/CIM systems, multi-material fabrication based on 3D printing. For more information, please see Dr. Huang’s website.
About UIC. Located in the heart of one of the world’s great cities, UIC is a vital part of the educational, technological and cultural fabric of the region. As Chicago’s only public research university with more than 33,000 students, 16 colleges, a hospital and a health sciences system, UIC provides students access to excellence and opportunity. More information can be found at UIC website.

Qualifications
Motivated Ph.D. students with background in design and manufacturing are highly encouraged to apply. Ideal candidates are expected to have a BS or master degree in Industrial Engineering, Mechanical Engineering, Electrical Engineering, Computer Science, Robotics, or closely related fields. It is desirable that the candidate has practical knowledge and experience in Matlab/Python/C++ programming, Solidworks, and/or Ansys. Deep learning tools and libraries such as Theano, TensorFlow or PyTorch will be valued for the position. Fluent communication skills (verbal, presentation, and writing in English) is required to enable effective interaction with technical peers, scholars, and sponsors.

Expected Start Time: Fall 2020. The deadline for applying the full scholarship is December 15, 2019. Candidates must submit an official application to the program in the MIE department on the administration website, and send CVs and letters of motivation to Dr. Huang jidahuan@buffalo.edu.